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Quality, complexity, and continued innovation demand flexible semiconductor test strategies In 2025, the automated test equipment (ATE) industry will be deeply influenced by semiconductor evolution. As chip sizes shrink and devices become more complex, the demand for advanced, flexible, and AI-driven testing solutions will increase. There is much on the horizon, as we approach the limitsRead More
As AI moves from a specialized workload into mainstream infrastructure, backend test is undergoing a quiet but decisive shift. The questions customers ask of test are changing, and so is the role test plays in the broader manufacturing flow. For decades, the industry operated with a simple guiding question: do we have a “Known GoodRead More
AI is redefining the infrastructure that powers it, and nowhere is that more true than at the compute layer. As server architectures and AI accelerators grow more complex, testing has to keep pace on both the hardware and software fronts. In this episode, Roy Chorev, Vice President and General Manager of the Compute Test Division,Read More
Key Summary Lithographic and reticle limits are forcing AI chips into 2.5D/3D chiplet packages, redefining where test must happen. With GPU prices heading toward $28K, “known-good everything”—metrology, ATE, and SLT together—is essential to protect yield. Testing now must happen on unpackaged CoW/CoP modules via C4 bumps, demanding new prober designs. Shrinking bump pitch and explodingRead More
